Layers

Single layer

Base Material

FR1,FR2,FR4,XPC CEM-1,CEM-3

Material Thickness

0.3- 3.2mm

Copper Thickness

0.5 OZ, 1OZ,2OZ,

Minimum Line Width

0.2mm

Minimum Line Spacing

0.2mm

Minimum Drilling Size

0.3mm

Maximum Hole Size

6.5mm

Minimum PAD Size

0.6 mm more than hole size

Minimum Solder mask Clearance

0.3 mm more than conduct pad

Minimum Solder mask Coverage

0.1 mm more than line edge

Line Width Reduce after Etching

0.02mm

Maximum Panel Length

510mm

Minimum Panel Length

120mm

Maximum Panel Width

410mm

Minimum Panel Width

120mm

Minimum Distance between Copper Trace and Panel side

0.5mm

Minimum Distance between Copper trace and Outline

0.5mm

Minimum Punching Hole Size

0.7mm

Minimum Punching Hole Spacing

1.5mm

Minimum Distance between Punching Hole edge and Panel side

1.0mm

Minimum Distance between Punching Pin hole and Panel side

1.25mm

Minimum V-cut Length

85mm

Minimum V-cut Width

30mm

Minimum V-cut Spacing

5-400mm (Hand made)

Minimum Distance from Outline to Panel side

2.0 mm (NPTD, Punching)
10 mm(Drill/HAL/PTD)

Minimum Carbon Circuit Width /Spacing

0.4mm

Solder Resistance

260℃/10Sec